JESDAE_电子/电路_工程科技_专业资料。JEDEC STANDARD High Temperature Storage Life JESDAE (Revision of. JEDEC STANDARD High Temperature Storage Life JESDAC (Revision of JESDAB) NOVEMBER JEDEC SOLID STATE. JESD A J-STD Preconditioning (PC): PC required for SMDs only. JESD A High Temperature Storage Life (HTSL). °C for hrs.
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JEDEC aa103 and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, jfsd22 interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
No claims jewd22 be in conformance with this standard may be made unless all requirements stated in the standard are met. X103 downloading this file the individual agrees not to charge for or resell the resulting material. The high temperature storage test is typically used to determine the effects of time and temperature, under storage conditions, for thermally activated failure mechanisms and time-tofailure distributions of solid state electronic devices, including nonvolatile memory devices data retention failure mechanisms.
Thermally activated failure mechanisms are modeled using the Arrhenius Equation for acceleration.
During the test, accelerated stress temperatures are used without electrical conditions applied. This test may be destructive, depending on time, temperature and packaging if any.
Table 1 — High temperature storage conditions Condition A: As a minimum the following items should be taken into consideration: Degradation of metals including metallurgical interfaces. Other conditions and durations may be used as appropriate.
Alternatively, application of a knowledge-based test method that reconciles use condition data JESD94 and an understanding of reliability models and failure mechanisms JEP can provide the test durations for any selected stress condition in Table 1.
The devices may be returned to room ambient conditions or any other defined temperature for interim electrical measurements. Interim measurements are optional unless otherwise specified. The time window need not be met if verification data for a given technology is provided.
If the final readpoint time window is exceeded then the units may be restressed for the same amount of time that the window is exceeded.
The electrical test measurements shall consist of parametric and functional tests specified in the applicable procurement document. For nonvolatile memories, the data specified data retention pattern must be written initially, and then subsequently jese22 without re-writing. For nonvolatile memories, the specified data retention pattern shall be verified before and after storage.
A margin test may be used to detect data retention degradation.
Mechanical damage, such as cracking, chipping, or breaking of the package, as defined in JESDB will be considered a failure, provided that such damage was not induced by fixtures or handling and it is critical to the package performance in the specific application.
Cosmetic package defects and degradation of lead finish, or solderability are not considered valid failure criteria for this stress.
Moisture soak as part of the preconditioning is optional. If the change to a concept involves any words added or deleted excluding deletion of accidentally repeated wordsit is included.
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Some 1a03 changes are not included. Modified text to emphasize that stress duration requirements are stated in qualification documents, such as JESD47 or in customer agreements, and not in this test method.
Modified item C to remove reference of stress duration requirement.
All comments will be collected and dispersed to the appropriate committee s. If you can provide input, please complete this form and return to: I recommend changes to the following: Requirement, clause number Test method number Clause number Fax: Other suggestions for document improvement: